Power converter module

ABSTRACT

A power converter module includes a multilayer printed circuit board, a switching device, a magnetic core element and a winding via. The multilayer printed circuit board has a first surface, a second surface and an inside layer. The multilayer printed circuit board includes a plurality of copper layers. The magnetic core element is disposed in the inside layer and includes a hole. One end of the winding via is electrically connected to the switching device, and the other end of the winding via is electrically connected to the second surface. The winding via penetrates through the hole and forms a magnetic assembly. An amount of the copper layers on a first side of the magnetic core element close to the first surface of the multilayer printed circuit board is at least two more than a second side of the magnetic core element.

CROSS-REFERENCE TO RELATED APPLICATION

This application claims priorities to China Patent Application No.202011164463.3 filed on Oct. 27, 2020, and China Patent Application No.202011251395.4 filed on Nov. 9, 2020, the entire contents of which areincorporated herein by reference for all purposes.

FIELD OF THE INVENTION

The present disclosure relates to a power converter module, and moreparticularly to a power converter module with different amounts ofcopper layers on both sides of the magnetic core element.

BACKGROUND OF THE INVENTION

With the rapid development of technologies such as mobile communicationsand cloud computing, high-power power converter modules have been widelyused in electronic products. Due to the trend of high power andminiaturization of electronic products, how to improve the conversionefficiency of the power converter module and reduce the size of thepower converter module is the primary consideration.

In the conventional power converter module, the magnetic core element isembedded in the multilayer printed circuit board to reduce the volume ofthe power converter module. For the convenience of the manufacturingprocess, the amount of the layers of the printed circuit board above themagnetic core element is the same with the amount of the layers of theprinted circuit board below the magnetic core element. However, thisarrangement may limit the wiring area and copper area above or below themagnetic core element, and increase the difficulty of wiring inside theprinted circuit board. In addition, as the wiring length increases, theparasitic loss of the wiring increases, and the interference betweensignals increases, thereby affecting the conversion efficiency of thepower converter module.

Therefore, there is a need of providing a power converter module toobviate the drawbacks encountered from the prior arts.

SUMMARY OF THE INVENTION

It is an object of the present disclosure to provide a power convertermodule. The magnetic core element of the power converter module isdisposed in a multilayer printed circuit board with multiple copperlayers, and the amount of the copper layers on one side of the magneticcore element is more than the amount of the copper layers on the otherside of the magnetic core element. Therefore, the larger amount of thecopper layers concentrated on one side of the magnetic core element canbe used to obtain a larger wiring area and copper laying area.Accordingly, enough space for wiring is provided to avoid the strongelectromagnetic field interference caused by the power loop. Moreover,the flexibility of the copper laying network is increased, and theparasitic resistance and parasitic inductance of the multilayer printedcircuit board are reduced, thereby improving the efficiency of powerconverter module.

In accordance with an aspect of the present disclosure, there isprovided a power converter module. The power converter module includes amultilayer printed circuit board, at least one switching device, atleast one magnetic core element and at least one winding via. Themultilayer printed circuit board has a first surface, a second surfaceand an inside layer. The first surface and the second surface areopposite, and the multilayer printed circuit board includes a pluralityof copper layers. The switching device is disposed on the first surfaceof the multilayer printed circuit board. The magnetic core element isdisposed in the inside layer of the multilayer printed circuit board,and the magnetic core element has at least one hole. A first end of thewinding via is electrically connected to the switching device, and asecond end of the winding via is electrically connected to the secondsurface of the multilayer printed circuit board. The winding viapenetrates through the hole of the magnetic core element and forms amagnetic assembly with the magnetic core element. An amount of a part ofthe plurality of copper layers on a first side of the magnetic coreelement close to the first surface of the multilayer printed circuitboard is at least two more than an amount of a part of the plurality ofcopper layers on a second side of the magnetic core element.

The above contents of the present invention will become more readilyapparent to those ordinarily skilled in the art after reviewing thefollowing detailed description and accompanying drawings, in which:

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic perspective view illustrating a power convertermodule according to an embodiment of the present disclosure;

FIG. 2 is an exploded view illustrating the power converter moduleaccording to the embodiment of the present disclosure;

FIG. 3 is a schematic side view illustrating the power converter moduleaccording to the embodiment of the present disclosure;

FIG. 4 is a schematic side view illustrating the power converter moduleaccording to the embodiment of the present disclosure;

FIG. 5 is a schematic view illustrating the second surface of the powerconverter module according to the embodiment of the present disclosure;

FIG. 6 is a schematic equivalent circuit diagram illustrating the powerconverter module of the present disclosure; and

FIG. 7 is a schematic side view illustrating the power converter moduleaccording to another embodiment of the present disclosure.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT

The present disclosure will now be described more specifically withreference to the following embodiments. It is to be noted that thefollowing descriptions of preferred embodiments of this disclosure arepresented herein for purpose of illustration and description only. It isnot intended to be exhaustive or to be limited to the precise formdisclosed.

FIG. 1 is a schematic perspective view illustrating a power convertermodule according to an embodiment of the present disclosure. FIG. 2 isan exploded view illustrating the power converter module according tothe embodiment of the present disclosure. FIG. 3 is a schematic sideview illustrating the power converter module according to the embodimentof the present disclosure. FIG. 4 is a schematic side view illustratingthe power converter module according to the embodiment of the presentdisclosure. As shown in FIGS. 1, 2, 3, and 4, the power converter module1 includes a multilayer printed circuit board 10, at least one switchingdevice 101, at least one capacitor device 102, at least one magneticcore element 103 and at least one winding via 105. The multilayerprinted circuit board 10 has a first surface 11, a second surface 12 andan inside layer 14. The first surface 11 and the second surface 12 areopposite, and the multilayer printed circuit board 10 includes aplurality of copper layers L1 to L8. The switching device 101 isdisposed on the first surface 11 of the multilayer printed circuit board10. The magnetic core element 103 is disposed in the inside layer 14 ofthe multilayer printed circuit board 10, and the magnetic core element103 has at least one hole 104. A first end of the winding via 105 iselectrically connected to the switching device 101, and a second end ofthe winding via 105 is electrically connected to the second surface 12of the multilayer printed circuit board 10. The winding via 105penetrates through the hole 104 of the magnetic core element 103 andforms a magnetic assembly with the magnetic core element 103. Thewinding via 105 is electrically connected to all or a part of the copperlayers L1 to L8. The capacitor device 102 is disposed on the firstsurface 11 of the multilayer printed circuit board 10. The capacitordevice 102 includes at least one capacitor, and the capacitor is aninput capacitor or an output capacitor. In an embodiment, the windingvia 105 is a straight hole or a stepped hole, more specifically, thewinding via 105 may have a straight structure or a partially bentstructure. The amount of the copper layers on a first side of themagnetic core element 103 close to the first surface 11 of themultilayer printed circuit board 10 is at least two more than the amountof the copper layers on a second side of the magnetic core element 103.In an embodiment, the amount of the copper layers on the first side ofthe magnetic core element 103 close to the first surface 11 of themultilayer printed circuit board 10 is at least three more than theamount of the copper layers on the second side of the magnetic coreelement 103. As shown in FIGS. 3 and 4, the multilayer printed circuitboard 10 includes eight copper layers L1 to L8 and eight dielectriclayers PP. The dielectric layer PP is disposed between the two adjacentcopper layers, however, the actual amount of the layers of themultilayer printed circuit board 10 is not limited thereto. In anembodiment, the magnetic core element 103 is disposed between the copperlayers L7 and L8 of the multilayer printed circuit board 10. As aresult, the amount of the copper layers L1 to L7 on the first side ofthe magnetic core element 103 close to the first surface 11 of themultilayer printed circuit board 10 is more than the amount of thecopper layer L8 on the other second side of the magnetic core element103, and the copper layers L1 to L7 can have a larger wiring area and alarger copper laying area. Since the amount of the copper layers on oneside of the magnetic core element 103 is more than the amount of thecopper layers on the other side of the magnetic core element 103 (e.g.,by two), a larger amount of copper layers concentrated on one side ofthe magnetic core element 103 can be used to obtain a larger wiring areaand a larger copper laying area. Accordingly, enough space for wiring isprovided to avoid the strong electromagnetic field interference causedby the power loop. Moreover, the flexibility of the copper layingnetwork is increased, and the parasitic resistance and parasiticinductance of the multilayer printed circuit board are reduced, therebyimproving the efficiency of power converter module.

FIG. 5 is a schematic view illustrating the second surface of the powerconverter module according to the embodiment of the present disclosure.In an embodiment, as shown in FIG. 5, the power converter module 1further includes at least one pad 13, and the at least one pad 13 isdisposed on the second surface 12 of the multilayer printed circuitboard 10. The pad 13 is a copper block pin or the surface copper skin ofthe multilayer printed circuit board 10. The pad 13 is fixed on thesecond surface 12, and the second end of the winding via 105 iselectrically connected to the pad 13.

FIG. 6 is a schematic equivalent circuit diagram illustrating the powerconverter module of the present disclosure. As shown in FIG. 6, thecapacitor device 102 includes an input capacitor Cin and an outputcapacitor Co, the magnetic assembly is an inductor Lo, and the windingvia 105 is served as the winding of the inductor Lo. The switchingdevice 101 includes at least one upper switch 1010 and at least onelower switch 1011 electrically connected to each other. The upper switch1010 and the lower switch 1011 can be, for example, MOSFET (Metal OxideSemiconductor Field Effect Transistor), but not limited thereto. A nodeSW is formed between the upper switch 1010 and the lower switch 1011,the node SW is electrically connected to the inductor Lo, and the nodeSW is electrically connected to the first end of the winding via 105. Anend of the input capacitor Cin is electrically connected to the upperswitch 1010 to form a positive input Vin+, the other end of the inputcapacitor Cin is electrically connected to the lower switch 1011 to forma negative input Vin−. Two ends of the output capacitor Co are connectedto the inductor Lo and lower switch 1011, respectively. In anembodiment, the inductor Lo is regarded as the magnetic assembly of theabove embodiment and is disposed in the inside layer 14 of themultilayer printed circuit board 10. The projections of the inductor Loand the switching device 101 on the first surface 11 at least partiallyoverlap with each other. The inductor Lo is electrically connected tothe positive output Vo+ of the power converter module 1, and thepositive output Vo+ is disposed on the second surface 12 of themultilayer printed circuit board 10. It is noted that only single-phasehalf-bridge branch is shown in FIG. 6, however, the actual powerconverter module may include multiple-phase half-bridge branchesconnected in parallel.

FIG. 7 is a schematic side view illustrating the power converter moduleaccording to another embodiment of the present disclosure. The elementsof FIG. 7 that are similar with those of FIG. 4 are represented by thesame reference numerals, and the detailed description thereof is omittedherein. In the embodiment shown in FIG. 7, the plurality of copperlayers include a plurality of positive copper layers and a plurality ofnegative copper layers, and the plurality of positive copper layers andthe plurality of negative copper layers are disposed in staggeredarrangement. In an embodiment, the positive copper layers include copperlayers L3, L5, and L7, and the negative copper layers include copperlayers L2, L4, and L6. The switching device 101 has a switching positiveterminal 101 a and a switching negative terminal 101 b. The capacitordevice 102 has a capacitor positive terminal 102 a and a capacitornegative terminal 102 b. The capacitor device 102 is disposed on thefirst surface 11 and is adjacent to the switching device 101, and thecapacitor device 102 forms a capacitor area. The power converter module1 further includes a first via 106, a second via 107, a third via 108and a fourth via 109. The first via 106 is electrically connected to theswitching positive terminal 101 a, the second via 107 is electricallyconnected to the switching negative terminal 101 b, the third via 108 iselectrically connected to the capacitor positive terminal 102 a, and thefourth via 109 is electrically connected to the capacitor negativeterminal 102 b. The first via 106 and the third via 108 are electricallyconnected to a part of the copper layer L1 (i.e., the part of the copperlayer L1 that is electrically connected to the switching positiveterminal 101 a and the capacitor positive terminal 102 a), the copperlayers L3, L5, L7, and a part of the copper layer L8 (i.e., the part ofthe copper layer L8 that is electrically connected to the positive inputVin+). The second via 107 and the fourth via 109 are electricallyconnected to a part of the copper layer L1 (i.e., the part of the copperlayer L1 that is electrically connected to the switching negativeterminal 101 b and the capacitor negative terminal 102 b), the copperlayers L2, L4, L6, and a part of the copper layer L8 (i.e., the part ofthe copper layer L8 that is electrically connected to the negative inputVin−). The positive copper layers and the negative copper layers aredisposed in staggered arrangement. The first via 106 and the third via108 are electrically connected to the positive input Vin+, and thesecond via 107 and the fourth via 109 are electrically connected to thenegative input Vin−. The positive input Vin+ and the negative input Vin−are disposed on the second surface 12 of the multilayer printed circuitboard 10. The arrow line in FIG. 7 represents the direction of the ACcurrent of this embodiment. The AC current loop of this embodiment isexemplified as follows. Taking the capacitor positive terminal 102 a ofthe capacitor device 102 as a starting point, the AC current flowsthrough the third via 108 and each positive copper layer, and then flowsinto the switching positive terminal 101 a of the switching device 101through the first via 106. Taking the switching negative terminal 101 bof the switching device 101 as a starting point, the AC current flowsthrough the second via 107 and each negative copper layer, and thenflows into the capacitor negative terminal 102 b of the capacitor device102 through the fourth via 109. The direction of the AC current flowingthrough the positive copper layer is opposite to the direction of the ACcurrent flowing through the adjacent negative copper layer. Theoverlapping parts of the first and third vias 106 and 108 and the copperlayers L2, L4, and L6 shown in FIG. 7 only represent the front-to-rearrelationship between the via and the copper layer under this viewingangle condition, rather than the actual connection. Similarly, theoverlapping parts of the second and fourth vias 107 and 109 and thecopper layers L3, L5, and L7 only represent the front-to-rearrelationship between the via and the copper layer under this viewingangle condition, rather than the actual connection. The AC currentflowing through the adjacent copper layers are in opposite directions sothat the AC magnetic fluxes between the adjacent copper layers canceleach other out, thereby reducing the parasitic inductance of the currentloop. Consequently, the conversion efficiency of the power conversionmodule is improved.

In addition, the power converter module 1 further includes a dielectriclayer PP, and the dielectric layer PP is disposed between two adjacentcopper layers. The projections of the adjacent positive and negativecopper layers and the capacitor area on the first surface 11 at leastpartially overlap with each other, thereby reducing the parasiticinductance of wiring and reducing the parasitic loss. Therefore, theconversion efficiency of the power converter module 1 is improved. In anembodiment, the first via 106, the second via 107, the third via 108,and the fourth via 109 are straight holes or stepped holes.

In an embodiment, a part of the copper layer L8 is electricallyconnected to the positive output of the power converter 1, and a part ofthe copper layer L8 is electrically connected to the negative output ofthe power converter module 1.

In an embodiment, when the amount of the positive copper layer on theside of the magnetic core element 103 is one, and the amount of thenegative copper layer is also one, the amount of the copper layers onone side of the magnetic core element 103 is two more than the amount ofthe copper layers on the other side of the magnetic core element 103.

It should be noted that the side view shown in FIG. 4 focuses on showingthe position and connection relationships of the copper layers, themagnetic core element and the corresponding winding via. The side viewshown in FIG. 7 focuses on showing the electrical connections of thepositive and negative copper layers, the switching device and thecapacitor device. In fact, the structures shown in FIGS. 4 and 7 can beimplemented in different power converter modules or in the same powerconverter module.

From the above descriptions, the present application provides a powerconverter module. The amount of the copper layers on one side of themagnetic core element is more than the amount of the copper layers onthe other side of the magnetic core element. Therefore, a larger amountof copper layers concentrated on one side of the magnetic core elementcan be used to obtain a larger wiring area and a larger copper layingarea. Accordingly, enough space for wiring is provided to avoid thestrong electromagnetic field interference caused by the power loop.Moreover, the flexibility of the copper laying network is increased, andthe parasitic resistance and parasitic inductance of the multilayerprinted circuit board are reduced, thereby improving the efficiency ofpower converter module. The present application provides a powerconverter module, by staggering the plurality of positive copper layersand the plurality of negative copper layers, and the plurality ofpositive copper layers and the plurality of negative copper layers areelectrically connected to the corresponding switching positive andnegative terminals, the capacitor positive and negative terminals, and aplurality of vias respectively. The projections of the adjacent positiveand negative copper layers and the capacitor area on the first surfaceat least partially overlap with each other, thereby reducing theparasitic inductance of the wiring and reducing the parasitic loss.Therefore, the conversion efficiency of the power conversion module isimproved.

While the disclosure has been described in terms of what is presentlyconsidered to be the most practical and preferred embodiments, it is tobe understood that the disclosure needs not be limited to the disclosedembodiment. On the contrary, it is intended to cover variousmodifications and similar arrangements included within the spirit andscope of the appended claims which are to be accorded with the broadestinterpretation so as to encompass all such modifications and similarstructures.

1. A power converter module, comprising: a multilayer printed circuitboard, wherein the multilayer printed circuit board has a first surface,a second surface and an inside layer, the first surface and the secondsurface are opposite, and the multilayer printed circuit board comprisesa plurality of copper layers; at least one switching device disposed onthe first surface of the multilayer printed circuit board; at least onemagnetic core element disposed in the inside layer of the multilayerprinted circuit board, wherein the magnetic core element has at leastone hole; and at least one winding via, wherein a first end of thewinding via is electrically connected to the switching device, and asecond end of the winding via is electrically connected to the secondsurface of the multilayer printed circuit board, and the winding viapenetrates through the hole of the magnetic core element and forms amagnetic assembly with the magnetic core element; wherein an amount of apart of the plurality of copper layers on a first side of the magneticcore element close to the first surface of the multilayer printedcircuit board is at least two more than an amount of a part of theplurality of copper layers on a second side of the magnetic coreelement; wherein the plurality of copper layers are configured forcircuit wiring, wherein the power converter module further comprises acapacitor device, wherein the capacitor device is disposed on the firstsurface of the multiplayer printed circuit board and comprises at leastone capacitor, and the at least one capacitor is an input capacitor oran output capacitor, wherein the switching device and the capacitordevice are electronically connected through the part of the plurality ofcopper layers on the first side.
 2. The power converter module accordingto claim 1, wherein the amount of the part of the plurality of copperlayers on the first side of the magnetic core element close to the firstsurface of the multilayer printed circuit board is at least three morethan the amount of the part of the plurality of copper layers on thesecond side of the magnetic core element.
 3. The power converter moduleaccording to claim 1, further comprising at least one pad, wherein thepad is disposed on the second surface of the multilayer printed circuitboard, and the second end of the winding via is electrically connectedto the pad.
 4. The power converter module according to claim 3, whereinthe pad is a copper block pin or a surface copper skin of the multilayerprinted circuit board, and the pad is fixed on the second surface. 5.The power converter module according to claim 1, wherein the winding viais electrically connected to all or a part of the plurality of copperlayers.
 6. The power converter module according to claim 1, wherein thewinding via is a straight hole or a stepped hole.
 7. The power convertermodule according to claim 1, wherein the magnetic assembly forms aninductor.
 8. (canceled)
 9. The power converter module according to claim1, wherein the switching device comprises at least one upper switch andat least one lower switch electrically connected to each other, whereina node is formed between the upper switch and the lower switch, and thenode is electrically connected to the first end of the winding via. 10.The power converter module according to claim wherein the plurality ofcopper layers comprises a plurality of positive copper layers and aplurality of negative copper layers, the plurality of positive copperlayers and the plurality of negative copper layers are disposed instaggered arrangement, and a direction of a current flowing through eachof the plurality of positive copper layers is opposite to a direction ofa current flowing through the adjacent negative copper layer.
 11. Thepower converter module according to claim 10, further comprising atleast one first via, at least one second via, at least one third via andat least one fourth via, wherein the first via is electrically connectedto a switching positive terminal of the switching device, the second viais electrically connected to a switching negative terminal of theswitching device, the third via is electrically connected to a capacitorpositive terminal of the capacitor device, and the fourth via iselectrically connected to a capacitor negative terminal of the capacitordevice, wherein the plurality of positive copper layers are electricallyconnected to the first via and the third via, and the plurality of thenegative copper layers are electrically connected to the second via andthe fourth via.